Established in 1989, Universen Hitec has always been a professional contract manufacturer for wafer back-end process service, including wafer grinding / dicing / sorting and so on!

Starting from Oct. 2001, Universen also buy, sell & service for  related equipments, such as dicing saws, back grinders, & etc.  For latest updates, please click here!.

Due to serious trash mail problem, your mails  might be wrongly deleted.  If you haven't received our reply, please re-send your message (use other address will be better)!

Unless otherwise specified, all the equipments listed on our website are owned by Universen or subsidiary.  Universen is not a pure broker.  Universen owns those equipments we're selling.

Universen has various of used equipments in stock, mainly grinders & dicing saws.  On-site inspection welcome.    equipment list click here!

Universen's capability:

Grinding thickness: 150um/6mil (for 6-inch wafer), 175um/7mil (for 8-inch wafer)

Sawing die-size:  200x200um at 150um thickness (cutting street width: 40um)

Got a jammed spindle, Universen can fix your spindle! 

No. 6, Lane 19, Kaoyang S. Road, Lungtan, Taoyuan, Taiwan. 325

Tel: +886-3-4710101, +886-3-4710101

Fax: +886-3-4719191

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All Rights Reserved, Universen 1998 - 2005 .